From the current LED technology point of view, still can not perfectly solve the core problem of photoelectric conversion efficiency, so the heat dissipation problem as a bottleneck problem in the development of the LED industry, in addition to adding heat sinks, packaging is the core link to solve the heat problem.

The current high-power LED packaging technology uses MCOB package, compared with the traditional COB packaging technology, MCOB's aluminum substrate welding chip without insulation layer, heat directly into the metal substrate, the rapid heat export, reduce the chip junction temperature, extend the plane light source Service life. The total thermal conductivity of the aluminum substrate in the conventional COB package mode is 2.2w/m•k, and the overall thermal conductivity of the MCOB is currently above 200w/m•k. Aluminum copper clad plate and copper materials have high thermal conductivity and can be directly contacted with chips. They can quickly derive the heat generated by the chips. The aluminum copper clad plate are metallurgically bonded. The transition layer between copper and aluminum is thin, and the heat transfer from the copper material to the aluminum material is performed. There is no extra thermal resistance in the process, which gives full play to the good thermal conductivity of copper materials and good heat dissipation performance of aluminum materials, reduces the overall thermal resistance of the package, effectively reduces the junction temperature of the chip, and makes more powerful LED packages possible . Using copper clad aluminum plate, the current high-power MCOB single-plant package has been upgraded from 20-30 watts of conventional MCPCB materials to 100-200 watts.