Copper clad aluminum busbar is one of our main products. It has many parameters. Among them, the purity of copper and aluminum, the volume ratio of copper layer and the bonding strength of the interface are the most critical parameters, which determine its electrical conductivity, mechanical Performance, processing performance and use performance.

In the conductive industry, in order to meet the needs of conductive properties, the copper material used should meet the T2 copper material requirements in GB / T5231, and the aluminum material should meet the 1060/3003 aluminum material requirements in GB / T3190.In order to ensure the electrical conductivity of copper clad aluminum busbar materials, the materials of the copper cladding and the aluminum base layer should first meet the standard requirements.
According to calculations, when the copper clad volume ratio of the copper clad aluminum busbar is 20%, the cost performance is optimal, and the current carrying capacity reaches 89% of the T2 copper busbar.For different needs in the industry, the conductivity of the material can be changed by adjusting the volume ratio of the copper cladding.Generally speaking, the volume ratio of copper cladding should not be lower than 15% and should not be higher than 30%. The higher the volume ratio of copper cladding, the better the conductivity.

Interfacial bonding strength is a basic property of copper clad aluminum busbar. The quality of copper-aluminum bonding strength is directly related to the application and safety of materials.Will the material be delaminated when bending, punching and shearing, and whether the stress caused by thermal expansion and contraction in areas with large temperature differences will damage the bonding layer, which are directly related to the interface bonding strength.The test and application prove that the interface bonding (shear) strength is greater than 35MPa, which can meet the application requirements.